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TechnologiesOverview

Technologies

Photolithography
Spin & Spray coating system [Track]

                                                             Spin coating                                                                                                                                 Spray coating 

We have track equipment compatible with spin and spray coating.
: 6~8in Process
: Fully Automated Process
: We have photoresist coating technology capable of achieving thicknesses ranging from 2 to 100 µm.
: We have photoresist coating technology for pattern implementation in cavities and 3D structures.


 
Contact Mask Aligner

[Front & Back side Alignment]

                                                              
                                                                                                                     Auto Contact Aligner


We have patterning technology with a resolution of >3 µm. 
We have double-side patterning technology using front-back side alignment equipment.
: 6~8 inch process capability
: Front alignment accuracy: ±3 µm [Fully automated process available]
: Front-back side alignment accuracy: ±5 µm [Manual process]

 
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